Vertiv has announced the expansion of its liquid cooling product portfolio, unveiling two new CoolChip coolant distribution units (CDUs) designed to optimize thermal management in modern data centers. The new systems cater to high-density computing environments, emphasizing efficiency and modularity.
The CoolChip CDU 2300kW, a liquid-to-liquid system, delivers a cooling capacity of 2.3 MW. This solution is tailored for hyperscalers and colocation providers aiming to implement large-scale liquid cooling for high-density deployments. According to Vertiv, the 2300kW model boasts the industry’s highest CDU capacity per square foot, allowing data center operators to minimize costs and physical footprint by requiring fewer units.
Meanwhile, the CoolChip CDU 350kW, a liquid-to-air system, facilitates direct-to-chip liquid cooling through air-based heat rejection. Its design enables retrofitting into existing facilities, providing an effective liquid cooling solution without necessitating a facility chilled water system.
Both new CoolChip CDUs are engineered to distribute coolant directly to liquid-cooled chips and rear-door heat exchangers. The systems incorporate advanced features, including unit-to-unit communication for system-level control, redundant power feeds, pumps, and filters to enhance cooling reliability. Additionally, integrated controls allow operators to remotely monitor and manage the units, ensuring seamless operations.
John Niemann, Senior Vice President of Vertiv’s thermal business unit, highlighted the importance of advanced cooling technologies in AI-driven data centers. “The AI-focused data center necessitates advanced cooling technologies. Vertiv’s expanded liquid-cooled solutions support the densification of the data center we are seeing as a result of AI,” he said.
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Niemann added, “Our liquid cooling portfolio, complemented by our full suite of air cooling, heat rejection, and re-use solutions, along with global services capability, enables both new and existing data centers to seamlessly introduce liquid cooling as part of the overall hybrid cooling solution. This makes AI deployments easier, faster, and more cost-effective for customers.”
The launch of these CoolChip CDUs underscores Vertiv’s commitment to providing cutting-edge cooling technologies that address the evolving needs of data centers, particularly in the context of AI and high-density computing demands.
