South Korean tech giant, Samsung Electronics is set to invest approximately 40 billion yen ($280 million) over the next five years in a research facility dedicated to advanced chip packaging in Japan.
The announcement was made by the city of Yokohama, where the facility will be established, providing Samsung with the opportunity to collaborate closely with Japanese companies specialising in chipmaking equipment and materials.
Samsung’s chip business head, Kyung Kye-hyun, has noted that the Japanese facility would not only strengthen Samsung’s position in the chip market but also facilitate partnerships with Yokohama-based companies specializing in chip packaging.
The facility will focus on advancing chip packaging technologies, exploring innovative techniques to combine components within a single package, enhancing overall chip performance, which aligns with the company’s efforts to bolster its advanced chip packaging department.
For its part, the Japanese industry ministry has pledged subsidies of up to 20 billion yen ($139,791 million) to support Samsung’s investment in chip manufacturing in Japan. This move is part of Japan’s broader initiative to revive domestic chip manufacturing.
Samsung’s investment comes during an improvement in relations between South Korea and Japan, encouraged by the United States to foster collaboration among allies to address the technological challenges posed by rival countries, particularly China.
The investment reflects Samsung’s commitment to advancing semiconductor technologies and fostering international collaboration to stay at the forefront of the rapidly evolving chip industry.
